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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
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without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. 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2010 description the pg2413t6m is a gaas mmic sp3t switch whic h was developed for bluetooth, wireless lan. this device can operate frequencies from 0.5 to 3.0 ghz, with low insertion loss. this device is housed in a 12-pin plastic tsqfn (t hin s mall q uad f lat n on-leaded) (t6m) package and is suitable for high-density surface mounting. features ? switch control voltage : v cont (h) = 3.0 v typ., v cont (l) = 0 v typ. ? low insertion loss : l ins = 0.35 db typ. @ f = 1.0 ghz : l ins = 0.45 db typ. @ f = 2.0 ghz : l ins = 0.50 db typ. @ f = 2.5 ghz ? high isolation : isl = 26 db typ. @ f = 1.0 ghz : isl = 20 db typ. @ f = 2.0 ghz : isl = 18 db typ. @ f = 2.5 ghz ? handling power : p in (0.1 db) = +28.0 dbm typ. @ f = 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v ? high-density surface mounting : 12-pi n plastic tsqfn (t6m) package (2.0 2.0 0.37 mm) applications ? bluetooth and i eee802.11b/g etc. ordering information part number order number package marking supplying form pg2413t6m-e2 pg2413t6m-e2-a 12-pin plastic tsqfn (t6m) (pb-free) 2413 ? embossed tape 8 mm wide ? pin 10, 11, 12 face the perforation side of the tape ? qty 3 kpcs/reel remark to order evaluation samples, pleas e contact your nearby sales office. part number for sample order: pg2413t6m data sheet caution although this device is designed to be as robust as possible, esd (electrostatic discharge) can damage this device. this device must be protected at all times from esd. static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. industry-standard esd precautions must be employed at all times. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. sp3t switch for bluetooth tm and 802.11b/g gaas integrated circuit pg2413t6m document no. pg10792ej01v0ds (1st edition) date published february 2010 ns printed in japan
pin connections and in ternal block diagram pin no. pin name 1 rfc 2 gnd 3 v cont 1 4 rf1 5 gnd 6 rf2 7 v cont 2 8 gnd 9 v cont 3 10 rf3 11 gnd (bottom view) 1 2 3 9 8 7 4 5 6 12 11 10 (top view) 6 5 4 10 11 12 1 2 3 9 8 7 2413 (top view) 6 5 4 10 11 12 1 2 3 9 8 7 rfc gnd v cont 1 rf1 gnd rf2 gnd gnd gnd rf3 v cont 3 v cont 2 12 gnd remark exposed pad : gnd truth table v cont 1 v cont 2 v cont 3 rfc ? rf1 rfc ? rf2 rfc ? rf3 high low low on off off low high low off on off low low high off off on data sheet pg10792ej01v0ds 2 pg2413t6m
absolute maximum ratings (t a = +25 c, unless otherwise specified) parameter symbol ratings unit switch control voltage v cont +6.0 note v input power (v cont (h) = 1.8 v) p in +26 dbm input power (v cont (h) = 2.3 v) p in +28 dbm input power (v cont (h) = 3.0 v) p in +32 dbm input power (v cont (h) = 3.6 v) p in +34 dbm operating ambient temperature t a ? 45 to +85 c storage temperature t stg ? 55 to +150 c note ? ?
electrical characteristics 1 (t a = +25 c, v cont (h) = 3.0 v, v cont (l) = 0 v, z o = 50 , dc blocking capacitors = 56 pf, unless otherwise specified) parameter symbol pass test conditions min. typ. max. unit insertion loss l ins rfc to rf1, 2, 3 f = 0.5 to 1.0 ghz ? 0.35 0.60 db f = 1.0 to 2.0 ghz ? 0.45 0.70 db f = 2.0 to 2.5 ghz ? 0.50 0.75 db f = 2.5 to 3.0 ghz ? 0.60 ? db isolation isl rfc to rf1, 2, 3 f = 0.5 to 1.0 ghz 23 26 ? db (off) f = 1.0 to 2.0 ghz 17 20 ? db f = 2.0 to 2.5 ghz 15 18 ? db f = 2.5 to 3.0 ghz ? 16 ? db return loss (rfc) rl c f = 0.5 to 3.0 ghz 15 20 ? db return loss (rf1, 2, 3) rl1, 2, 3 f = 0.5 to 3.0 ghz 15 20 ? db 0.1 db loss compression p in (0.1 db) rfc to rf1, 2, 3 f = 2.5 ghz +25.0 +28.0 ? dbm input power note 1 1 db loss compression input power note 2 p in (1 db) rfc to rf1, 2, 3 f = 2.5 ghz, v cont (h) = 2.3 v ? +27.0 ? dbm f = 2.5 ghz, v cont (h) = 3.0 v ? +31.0 ? dbm f = 2.5 ghz, v cont (h) = 3.6 v ? +33.0 ? dbm 2nd harmonics 2f0 f = 2.5 ghz, p in = 23 dbm ? 75 ? dbc 3rd harmonics 3f0 f = 2.5 ghz, p in = 23 dbm ? 75 ? dbc switch control current i cont no rf input ? 0.1 5.0 a switch control speed t sw 50% ctl to 90/10% rf ? 50 ? ns notes 1. p in (0.1 db) is the measured input power leve l when the insertion loss increases 0.1 db more t han that of the linear range. 2. p in (1 db) is the measured input power leve l when the insertion loss increases 1 db more than that of the linear range. caution it is necessary to use dc bl ocking capacitors with this device. data sheet pg10792ej01v0ds 4 pg2413t6m
electrical characteristics 2 (t a = +25 c, v cont (h) = 1.8 v, v cont (l) = 0 v, z o = 50 , dc blocking capacitors = 56 pf, unless otherwise specified) parameter symbol pass test conditions min. typ. max. unit insertion loss l ins rfc to rf1, 2, 3 f = 0.5 to 1.0 ghz ? 0.35 0.65 db f = 1.0 to 2.0 ghz ? 0.45 0.75 db f = 2.0 to 2.5 ghz ? 0.50 0.80 db f = 2.5 to 3.0 ghz ? 0.65 ? db isolation isl rfc to rf1, 2, 3 f = 0.5 to 1.0 ghz 22.5 25.5 ? db (off) f = 1.0 to 2.0 ghz 16.5 19.5 ? db f = 2.0 to 2.5 ghz 14.5 17.5 ? db f = 2.5 to 3.0 ghz ? 15.5 ? db return loss (rfc) rl c f = 0.5 to 3.0 ghz 15 20 ? db return loss (rf1, 2, 3) rl1, 2, 3 f = 0.5 to 3.0 ghz 15 20 ? db 0.1 db loss compression p in (0.1 db) rfc to rf1, 2, 3 f = 2.5 ghz +19.0 +22.0 ? dbm input power note 1 1 db loss compression p in (1 db) rfc to rf1, 2, 3 f = 2.5 ghz +21.0 +25.0 ? dbm input power note 2 2nd harmonics 2f0 f = 2.5 ghz, p in = 17 dbm ? 75 ? dbc 3rd harmonics 3f0 f = 2.5 ghz, p in = 17 dbm ? 75 ? dbc switch control current i cont no rf input ? 0.1 5.0 a switch control speed t sw 50% ctl to 90/10% rf ? 50 ? ns notes 1. p in (0.1 db) is the measured input power leve l when the insertion loss increases 0.1 db more t han that of the linear range. 2. p in (1 db) is the measured input power leve l when the insertion loss increases 1 db more than that of the linear range. caution it is necessary to use dc bl ocking capacitors with this device. data sheet pg10792ej01v0ds 5 pg2413t6m
evaluation circuit 1 2 3 v cont 1 rf3 rf1 4 5 6 9 8 7 12 11 10 1 000 pf rfc 56 pf 56 pf rf2 56 pf v cont 2 1 000 pf v cont 3 1 000 pf 56 pf the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. application information l esd c b c b c b switch ? c b are dc blocking capacitors external to the device. a value of 56 pf is sufficient for operation from 500 mhz to 2.5 ghz bands. the value may be tailored to prov ide specific electrical responses. ? the rf ground connections should be k ept as short as possible and connect ed to directly to a good rf ground for best performance. ? l esd provides a means to increase the esd protection on a specific rf port, typically the port attached to the antenna. data sheet pg10792ej01v0ds 6 pg2413t6m
typical characteristics ( t a = +25 c, dc blocking capacitors = 56 pf, unless otherwise specified ) insertion loss l ins (db) frequency f (ghz) rfc-rf1/rf2/rf3 insertion loss vs. frequency ?0.1 ?0.3 ?0.7 1.5 3.0 0.5 1.0 2.0 2.5 0.0 ?0.2 ?0.4 ?0.5 v cont (h) = 3.0 v 1.8 v isolation isl (db) frequency f (ghz) rfc-rf1/rf2/rf3 isolation vs. frequency 0 ?5 ?10 ?15 ?20 ?25 ?30 ?35 ?40 1.5 3.0 0.5 1.0 2.0 2.5 0.0 3.0 v v cont (h) = 1.8 v return loss (rfc) rl c (db) frequency f (ghz) return loss (rfc) vs. frequency 1.5 3.0 0.5 1.0 2.0 2.5 0.0 v cont (h) = 3.0 v 1.8 v insertion loss l ins (db) switch control voltage (h) v cont (h) (v) rfc-rf1/rf2/rf3 insertion loss vs. switch control voltage (h) 3.0 4.0 2.0 2.5 3.5 1.5 f = 1.0 ghz isolation isl (db) switch control voltage (h) v cont (h) (v) rfc-rf1/rf2/rf3 isolation vs. switch control voltage (h) ?0.6 0 ?5 ?10 ?15 ?20 ?25 ?30 ?35 ?40 return loss (rf1, 2, 3) rl1, 2, 3 (db) frequency f (ghz) return loss (rf1, 2, 3) vs. frequency 1.5 3.0 0.5 1.0 2.0 2.5 0.0 v cont (h) = 3.0 v 1.8 v 0 ?5 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ?0.1 ?0.3 ?0.7 ?0.2 ?0.4 ?0.5 ?0.6 2.5 ghz 3.0 4.0 2.0 2.5 3.5 1.5 f = 2.5 ghz 0 ?10 ?30 ?5 ?15 ?20 ?25 1.0 ghz remark the graphs indicate nominal characteristics. data sheet pg10792ej01v0ds 7 pg2413t6m
insertion loss l ins (db) input power p in (dbm) rfc-rf1/rf2/rf3 insertion loss, i cont vs. input power 0 ?0.5 ?1.0 ?1.5 ?2.0 ?2.5 ?3.0 25 35 20 30 10 v cont (h) = 3.0 v 1.8 v 18 15 12 9 6 3 0 switch control current i cont ( a) f = 2.5 ghz 3.0 v 1.8 v l ins i cont return loss (rfc) rl c (db) return loss (rfc) vs. switch control voltage (h) 0 ?5 ?10 ?15 ?20 ?25 ?30 ?35 ?40 switch control voltage (h) v cont (h) (v) 3.0 4.0 2.0 2.5 3.5 1.5 f = 2.5 ghz 1.0 ghz return loss (rf1, 2, 3) rl1, 2, 3 (db) return loss (rf1, 2, 3) vs. switch control voltage (h) 0 ?5 ?10 ?15 ?20 ?25 ?30 ?35 ?40 switch control voltage (h) v cont (h) (v) 3.0 4.0 2.0 2.5 3.5 1.5 f = 2.5 ghz 1.0 ghz 15 1 db loss compression input power p in (1 db) (dbm) 0.1 db loss compression input power p in (0.1 db) (dbm) switch control voltage (h) v cont (h) (v) rfc-rf1/rf2/rf3 p in (1 db) , p in (0.1 db) vs. switch control voltage (h) 34 32 30 28 26 24 22 20 2.4 3.9 1.8 2.1 2.7 3.3 1.5 3.6 f = 2.5 ghz p in (0.1 db) 3.0 p in (1 db) remark the graphs indicate nominal characteristics. data sheet pg10792ej01v0ds 8 pg2413t6m
mounting pad and solder mask layout dimensions 12-pin plastic tsqfn (t6m) (unit: mm) mounting pad solder mask solder thickness : 0.1 mm 0.94 0.5 1.15 0.5 1.15 0.5 1.15 0.5 1.15 0.94 12?0.23 0.77 0.77 0.77 0.77 0.5 0.5 0.73 1.125 1.125 0.795 0.795 0.73 12?0.18 0.795 0.795 1.125 1.125 0.5 0.5 remark the mounting pad and solder mask layouts in this document are for reference only. when designing pcb, please consider wo rkability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. data sheet pg10792ej01v0ds 9 pg2413t6m
package dimensions 12-pin plastic tsqfn (t6m) (unit: mm) 2.00.1 2.00.1 (bottom view) 0.230.1 0.940.1 0.940.1 0.23 +0.07 ?0.05 0.11 min. a a (c 0.17) 0.500.06 0.37 +0.03 ?0.05 remark a > 0 ( ): reference value data sheet pg10792ej01v0ds 10 pg2413t6m
recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomm ended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 partial heating peak temperatur e (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering met hods together (except for partial heating). data sheet pg10792ej01v0ds 11 pg2413t6m
bluetooth is a trademark owned by bluetooth sig, inc., u.s.a. the information in this document is current as of february, 2010. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. in addition, nec electronics products are not taken measures to prevent radioactive rays in the product design. when customers use nec electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of nec electronics products. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e0904e (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific": data sheet pg10792ej01v0ds 12 pg2413t6m
caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. ? do not burn, destroy, cut, crush, or chemically di ssolve the product. ? do not lick the product or in any way allow it to enter the mouth. pg2413t6m

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